德律TR7700SIIIDT介绍:
TR7700 SIII DT是一台高性能的离线型AOI解决方案,拥有最高精度和易用性等优点。使用TRI独有的多相位光源和新一代的检测软件,TR7700 SIII DT具备快速和简易编程等优良的缺陷检测功能,非常适合变化度高生产线。
德律TR7700SIIIDT特性:
1. 为炉前/炉后检测之精度高离线型AOI解决方案
2.快速、易编程且符合IPC标准规范
3.先进的演算法和多相位光源将误判降至最低
德律TR7700SIIIDT规格:
Optical System
Imaging Method | Dynamic Imaging |
Top Camera | 4 Mpix |
Angle Camera | N/A |
Imaging Resolution | 10 µm, 15 µm (factory setting) |
Lighting | Multi-phase RGB+W LED |
3D Technology | N/A |
Max. 3D Range | N/A |
Inspection Performance
Imaging Speed | 4 Mpix@ 10 µm: 60 cm²/sec 4 Mpix@ 12.5 µm: 120 cm²/sec |
Motion Table & Control
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1 µm |
Board Handling
Max PCB Size | TR7700 SIII DT: 330 x 250 mm TR7700L SIII DT: 510 x 460 mm |
PCB Thickness | 3 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm [48 mm optional] |
Bottom Clearance | TR7700 SIII DT: 100 mm TR7700L SIII DT: 50 mm |
Edge Clearance | 3 mm |
Conveyor | Manual |
Inspection Functions
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material |
Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions
WxDxH | TR7700 SIII DT: 860 x 1100 x 1350 mm TR7700L SIII DT: 980 x 1345 x 1490 mm |
Weight | TR7700 SIII DT: 340 kg TR7700L SIII DT: 385 kg |