德律TR7700SIII3D介绍：
TRI开创性的3D AOI解决方案，采用超高速混合式PCB检测法，结合光学与蓝光雷射3D真实轮廓测量，对于自动化检测不良现象可达到最大化覆盖率。结合最先进的软体解决方案以及第三代智能化硬体平台，可提供稳定且强大的3D 焊点与元件缺陷检测，具备高检测覆盖率与简易编程优点。
德律TR7700SIII3D特性：
1.高速2D+3D检测，可检测至01005元件
2.高缺陷覆盖率，采用混合式2D+3D检测技术
3.真实3D轮廓量测技术，采用双雷射单位
4.具备自动化资料库与离线编程功能的智能化快速编程介面
德律TR7700SIII3D规格：
Optical System
| Imaging Method | Dynamic Imaging with true 3D profile measurement |
| Top Camera | 4 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 10 µm, 15 µm (factory setting) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | Single/Dual 3D laser sensors |
| Max. 3D Range | 20 mm |
Inspection Performance
| Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec 4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec* 4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec* * Depending on board size and laser resolution |
Motion Table & Control
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 µm |
Board Handling
| Max PCB Size | TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions
| WxDxH | TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1650 x 1650 mm TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg TR7700 SIII 3D DL: 1150 kg |
