德律TR7700Q介绍：
TR7700Q 3D AOI 拥有数位四向条纹光投影技术，结合最新颖的2D+3D 检测技术，为组装电路板检测领域掀起全新革命。全方位3D数位条纹光技术涵盖检测范围广阔，拥有极佳的精准性呈现极小共面缺陷及焊点问题。 TRI的3D锡点及爬锡检测符合IPC标准，确保爬锡的品质。藉由检查爬锡高度及体积，TR7700Q 3D AOI可检测出少锡、缺锡、空焊等不良现象。
德律TR7700Q特性：
1.超高精准度 2D+3D AOI 走停式取像
2. 爬锡高度及体积检测功能
3. 清晰且可靠的3D四光源数位条纹光
4. 可变频3D检测范围高度高达 30 mm
5. 免空压智能化自动运输送带系统(IACS)
德律TR7700Q规格：
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Top Camera | 4 Mpix or 12 Mpix (factory setting) |
| Angle Camera | N/A |
| Imaging Resolution | 5.5 µm, 10 µm, 15 µm (factory setting) |
| Lighting | Multi-phase True Color LED |
| 3D Technology | Quad Digital Fringe Projectors |
| Max. 3D Range | 4 Mpix@ 15 µm: 0-30 mm* 12 Mpix@ 5.5 µm: 0-4 mm 12 Mpix@ 10 µm: 0-30 mm* *Need GPU card upgrade |
Inspection Performance
| Imaging Speed | 4 Mpix@ 15 µm: 21 cm²/sec 12 Mpix@ 10 µm: 14.5 cm²/sec 12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress Note: Depending on component distribution |
Motion Table & Control
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | Ballscrew + AC-servo controller |
| X-Y Axis Resolution | 1 μm with linear encoder |
Board Handling
| Max PCB Size | TR7700QI @ 5.5 µm: 330 x 330 mm* TR7700QI @ 10 µm, 15 µm: 510 x 460 mm TR7700QI DL @ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane *Depending on component distribution, the vailable PCB size could be different |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 5.5 µm: 25 mm 10 µm: 50 mm 15 µm: 40 mm |
| Bottom Clearance | 40 mm [100 mm optional] |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
