德律TR7500QE介绍：
TR7500QE AOI 藉由结合以四向可调变数位条纹光投影及四个低视角相机为基础的新世代多角度2D和3D技术，提供了优越的3D锡点和元件组装检测功能。最新的检测软体采用快速CAD资料的编程及高度可客制化模板。
德律TR7500QE特性：
1. 多角度2D+3D覆盖率
2. 四向数位条纹光投影
3. 四个低角度相机
4.3D高度检测范围可高达40 mm
5. 高速CoaXPress取像
6.可选配3D雷射模组
德律TR7500QE规格：
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Top Camera | 12 Mpix |
| Angle Camera | 6.5 Mpix |
| Imaging Resolution | 10 µm, 15 µm (factory setting) |
| Lighting | Multi-phase true color LED, Coaxial lighting |
| 3D Technology | Quad Digital Fringe Projectors |
| Max. 3D Range | 12 Mpix@ 10 µm: 0-10 mm 12 Mpix@ 15 µm: 0-40 mm* * Need GPU card upgrade |
Inspection Performance
| Imaging Speed | 12 Mpix@ 10 µm: 13.5 cm²/sec 12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress 12 Mpix@ 15 µm: 30 cm²/sec 12 Mpix@ 15 µm: 50 cm²/sec with optional CoaXPress Note: The inspection time will vary depending on the configuration |
Motion Table & Control
| X-Axis Control | Ballscrew + AC-servo controller (Linear motor optional) |
| Y-Axis Control | Dual driven ballscrew + AC-servo controller |
| Z-Axis Control | Ballscrew + AC-servo controller |
| X-Y Axis Resolution | 1 µm |
Board Handling
Inspection Functions
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
