德律TR7007Q介绍：
TR7007Q SPI建基于最新的3D投影技术，提供业界领先的检验精度，可应用于各式严苛的制程环境。TR7007Q在线型检测系统，可自动优化检查路线以提供最佳的性能表现。且TRI创新的智能板弯补偿系统可弥补检查过程中的板弯。可选择双光源或四光源数位条纹投影检测，这是一款提供多种锡膏检测解决方案的产品，让您全面掌握高精度与高速度的优异效能。
德律TR7007Q特性：
1.100％无阴影的双光源/四光源数位条纹投影检测
2.优化的走停式设计最大精度
3.智能板弯补偿可免除PCB变形的问题
4.100％的锡膏缺陷覆盖率，低锡桥亦可检出
德律TR7007Q规格：
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Camera | 4 Mpix or 12 Mpix (factory setting) |
| Imaging Resolution | 6 μm, 10 μm , 15 µm (factory setting) |
| Lighting | RGB True Color LED |
| 3D Technology | 4-way Digital Fringe Pattern |
| Field of View | 4 Mpix@ 10 µm: 20.3 x 20.3 mm 4 Mpix@ 15 µm: 30.5 x 30.5 mm 12 Mpix@ 6 µm: 24.4 x 18.4 mm* 12 Mpix@ 10 µm: 40.8 x 30.7 mm 12 Mpix@ 15 µm: 61.2 x 46.1 mm * 6 μm is not available for TR7007Q DL |
Inspection Performance
| Imaging Speed | 4 Mpix: 3 FOV/sec 12 Mpix: 2 FOV/sec 12 Mpix CoaXPress: 3 FOV/sec* Note: Inspection speed depends on PCB and inspection conditions * With optional CoaXPress upgrade |
| Height Resolution | @ 6 µm: 0.22 µm @ 10/15 µm: 0.4 µm |
| Max. Solder Height | @ 6 µm: 210/420 µm @ 10/15 µm: 420/840 µm |
Motion Table & Control
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | Ballscrew + AC-servo controller |
| X-Y Axis Resolution | 0.5 µm with linear scale |
| Z-Axis Resolution | 0.5 µm with linear scale |
Board Handling
| Max PCB Size | TR7007Q: 510 x 460 mm* TR7007Q DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane * 6 μm is only available for TR7007Q, the Max. PCB size is 330 x 310 mm |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm |
| Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Inspection Functions
| Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
| Measurement | Height Area Volume Offset |
